Latest round

Series B

Last raised

Aug 2026

Total raised

$44M

Investors

11

About XUNLIN

, trading as XUNLIN, is a company that provides surface treatment process services for electronic substrates and mainly develops copper cladding and other technologies with its own PVD deposition technology. The company has production lines in Tianjin and Qingdao. The company's chairman, Hongbin Zhen, previously worked at Electrolux and founded the coating technology company Scienwood., which can solve the problems of copper-clad glass substrates in the development of semiconductors to advanced processes as well as in high-definition display modules. The company generates revenue by providing surface metallization of ceramic and glass electronic substrates.

Who invested in XUNLIN

11 investors across 3 rounds

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Funding rounds

  1. Series B

    Aug 4, 2026

    Amount

    $30M

    Investors

    Locked

  2. Series A

    Feb 5, 2026

    Amount

    $14M

    Investors

    Locked

  3. Angel

    Jul 16, 2024

    Amount

    Undisclosed

    Investors

    Locked

Questions about XUNLIN

Who invested in XUNLIN?

XUNLIN has 11 investors on record across 3 venture rounds. Sign up free to see every VC on the cap table and the rounds they joined.

How much funding has XUNLIN raised?

XUNLIN has raised 3 venture rounds. Sign up free to see how much each round raised and the total.

When did XUNLIN last raise money?

XUNLIN's most recent round on record is a Series B, in Aug 2026.

What does XUNLIN do?

, trading as XUNLIN, is a company that provides surface treatment process services for electronic substrates and mainly develops copper cladding and other technologies with its own PVD deposition technology.

Where is XUNLIN headquartered?

XUNLIN is headquartered in Tianjin, China.

Which VCs invest in companies like XUNLIN?

Among active investors with capital left to deploy, Yufu Capital, ICBC Capital Management, Ningbo Tongshang Fund and Boc Private Equity Firm back materials companies at XUNLIN's stage. Their profiles are linked below.

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