XCIC
Latest round
- Series B
Last raised
- Nov 2024
Total raised
- Undisclosed
Investors
- 3
About XCIC
Based in Zibo, China, and founded in 2021, XCIC operates as a packaging material manufacturer that mainly provides IC substrates for advanced packaging. It has acquired 39 patents and 5 software copyrights. The company mainly provides IC packaging substrate. Products include FC-CSP (Flip Chip- Chip Scale Package) package substrate, FC-BGA (Flip Chip- Ball Grid Array) package substrate, and SIP (System in Package) package substrate. The products can be applied to data centers, artificial intelligence, automotive electronics, and other scenarios. The company generates revenue by providing IC packaging substrate such as FC-CSP package substrate and SIP package substrate. The company plans to achieve mass production of FC-CSP and FC-BGA in 2025. In 2026, the second phase of FC-BGA products will be expanded.
Who invested in XCIC
3 investors across 1 round
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Funding rounds
Series B
Nov 29, 2024
Amount
Undisclosed
Investors
Questions about XCIC
Who invested in XCIC?
XCIC has 3 investors on record across 1 venture round. Sign up free to see every VC on the cap table and the rounds they joined.
How much funding has XCIC raised?
XCIC has raised 1 venture round. Sign up free to see how much each round raised and the total.
When did XCIC last raise money?
XCIC's most recent round on record is a Series B, in Nov 2024.
What does XCIC do?
Based in Zibo, China, and founded in 2021, XCIC operates as a packaging material manufacturer that mainly provides IC substrates for advanced packaging.
Where is XCIC headquartered?
XCIC is headquartered in Zibo, China.
Which VCs invest in companies like XCIC?
Among active investors with capital left to deploy, Yufu Capital, ICBC Capital Management, Ningbo Tongshang Fund and Boc Private Equity Firm back materials companies at XCIC's stage. Their profiles are linked below.
VCs backing materials startups at Series B
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