Shenzhen Wanpu Bond Technology Co.
Latest round
- Series A
Last raised
- Jun 2017
Total raised
- Undisclosed
Investors
- 1
About Shenzhen Wanpu Bond Technology Co.
, Ltd. is a medical technology company that focuses on providing comprehensive Internet medical remote digital solutions and remote service platforms., etc. The company's main product is a B2B full medical supply chain empowerment and operation service platform. The platform provides networked remote outpatient services, remote diagnosis, testing modules and services. The company’s revenue is generated by providing Internet medical remote products and services.
Who invested in Shenzhen Wanpu Bond Technology Co.
1 investor across 1 round
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Funding rounds
Series A
Jun 30, 2017
Amount
Undisclosed
Investors
Questions about Shenzhen Wanpu Bond Technology Co.
Who invested in Shenzhen Wanpu Bond Technology Co.?
Shenzhen Wanpu Bond Technology Co. has 1 investor on record across 1 venture round. Sign up free to see every VC on the cap table and the rounds they joined.
How much funding has Shenzhen Wanpu Bond Technology Co. raised?
Shenzhen Wanpu Bond Technology Co. has raised 1 venture round. Sign up free to see how much each round raised and the total.
When did Shenzhen Wanpu Bond Technology Co. last raise money?
Shenzhen Wanpu Bond Technology Co.'s most recent round on record is a Series A, in Jun 2017.
What does Shenzhen Wanpu Bond Technology Co. do?
Shenzhen Wanpu Bond Technology Co. is a healthcare it company.
Where is Shenzhen Wanpu Bond Technology Co. headquartered?
Shenzhen Wanpu Bond Technology Co. is headquartered in Shenzhen, China.
Which VCs invest in companies like Shenzhen Wanpu Bond Technology Co.?
Among active investors with capital left to deploy, Shanghai State-owned Capital Investment Leading Fund, Hui Hua Fund, Yufu Capital and ICBC Capital Management back healthcare it companies at Shenzhen Wanpu Bond Technology Co.'s stage. Their profiles are linked below.
VCs backing healthcare it startups at Series A
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