Reexen
Latest round
- Series B
Last raised
- Apr 2026
Total raised
- $45M
Investors
- 13
About Reexen
Based in Shenzhen, China and founded in 2018, Shenzhen Reexen Technology Liability Company, trading under the name Reexen, primarily engages in the design of high-performance compute-in-memory chips. The company has established branches in Chengdu, Shanghai, and Switzerland. Its founder, Dr. Liu Hongjie, leads a core team with experience in high-performance integrated circuit design, computing architectures, and deep learning. Reexen develops high-speed interconnect chips, ultra-low power consumption sensor processing chips, low-power and medium-power vision co-processors, etc. The chips are used as hardware solutions for artificial intelligence computing, wearable devices, internet of things (IoT), smart homes, and other fields. The company's revenue is generated from developing, selling, and intellectual property licensing of compute-in-memory chips.
Who invested in Reexen
13 investors across 5 rounds
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Questions about Reexen
Who invested in Reexen?
Reexen has 13 investors on record across 5 venture rounds. Sign up free to see every VC on the cap table and the rounds they joined.
How much funding has Reexen raised?
Reexen has raised 5 venture rounds. Sign up free to see how much each round raised and the total.
When did Reexen last raise money?
Reexen's most recent round on record is a Series B, in Apr 2026.
What does Reexen do?
Based in Shenzhen, China and founded in 2018, Shenzhen Reexen Technology Liability Company, trading under the name Reexen, primarily engages in the design of high-performance compute-in-memory chips.
Where is Reexen headquartered?
Reexen is headquartered in Shenzhen, China.
Which VCs invest in companies like Reexen?
Among active investors with capital left to deploy, Shanghai State-owned Capital Investment Leading Fund, Yufu Capital, ICBC Capital Management and Ningbo Tongshang Fund back electronics companies at Reexen's stage. Their profiles are linked below.
VCs backing electronics startups at Series B
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