National Center for Advanced Packaging Co.
Latest round
- Series A
Last raised
- Jan 2022
Total raised
- $31M
Investors
- 2
About National Center for Advanced Packaging Co.
, Ltd. is an electronic information company that focuses on the research and development of semiconductor packaging and testing pilot technology. As of 2022, the company's R&D team consists of the Chinese Academy of Sciences, with nearly 100 R&D personnel, more than half of whom have doctoral degrees and master's degrees. Besides, the company has R&D platform includes 3200?5D/3D IC backend processes and packaging assembly, testing and reliability, as well as design and simulation capabilities. As of 2021, a total of 1,083 patents have been applied for, including 950 invention patents, 46 international invention patents, and a total of 561 valid authorized patents, including 444 invention patents and 12 international authorized patents., Ltd. The company self-developed technology includes package design, simulation, mid-end wafer level packaging technology, microsystem integration technology, test& analysis and optoelectronic devices packaging technology. The company's main business is research and development wafer-level high-density packaging process and SiP product application. Besides, the company provides design simulation services, advanced packaging technology services and reliability testing and failure analysis for customer. The company’s revenue is generated by providing wafer-level high-density packaging process services and SiP product applications.
Who invested in National Center for Advanced Packaging Co.
2 investors across 1 round
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Funding rounds
Series A
Jan 10, 2022
Amount
$31M
Investors
Questions about National Center for Advanced Packaging Co.
Who invested in National Center for Advanced Packaging Co.?
National Center for Advanced Packaging Co. has 2 investors on record across 1 venture round. Sign up free to see every VC on the cap table and the rounds they joined.
How much funding has National Center for Advanced Packaging Co. raised?
National Center for Advanced Packaging Co. has raised 1 venture round. Sign up free to see how much each round raised and the total.
When did National Center for Advanced Packaging Co. last raise money?
National Center for Advanced Packaging Co.'s most recent round on record is a Series A, in Jan 2022.
What does National Center for Advanced Packaging Co. do?
National Center for Advanced Packaging Co. is a electronics company.
Where is National Center for Advanced Packaging Co. headquartered?
National Center for Advanced Packaging Co. is headquartered in Wuxi, China.
Which VCs invest in companies like National Center for Advanced Packaging Co.?
Among active investors with capital left to deploy, Shanghai State-owned Capital Investment Leading Fund, Hui Hua Fund, Yufu Capital and ICBC Capital Management back electronics companies at National Center for Advanced Packaging Co.'s stage. Their profiles are linked below.
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