Honglin Lianjie

ElectronicsSeries ASuzhou, China

Latest round

Series A

Last raised

Dec 2024

Total raised

Undisclosed

Investors

1

About Honglin Lianjie

Founded in 2004 and based in Changshu, China, Honglin Lianjie operates as an electronic components manufacturer that focuses on the production and sales of precision stamping dies and electronic components. The company is mainly engaged in the research and development, production and sales of a full range of electromechanical components. Products include instrument connectors, non-ferrous metal composite materials, precision stamping dies, precision cavity dies, metal stamping parts, data transmission cables, power cables, etc. The company generates revenue by providing electromechanical components and related products.

Who invested in Honglin Lianjie

1 investor across 1 round

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Funding rounds

  1. Series A

    Dec 26, 2024

    Amount

    Undisclosed

    Investors

    Locked

Questions about Honglin Lianjie

Who invested in Honglin Lianjie?

Honglin Lianjie has 1 investor on record across 1 venture round. Sign up free to see every VC on the cap table and the rounds they joined.

How much funding has Honglin Lianjie raised?

Honglin Lianjie has raised 1 venture round. Sign up free to see how much each round raised and the total.

When did Honglin Lianjie last raise money?

Honglin Lianjie's most recent round on record is a Series A, in Dec 2024.

What does Honglin Lianjie do?

Founded in 2004 and based in Changshu, China, Honglin Lianjie operates as an electronic components manufacturer that focuses on the production and sales of precision stamping dies and electronic components.

Where is Honglin Lianjie headquartered?

Honglin Lianjie is headquartered in Suzhou, China.

Which VCs invest in companies like Honglin Lianjie?

Among active investors with capital left to deploy, Shanghai State-owned Capital Investment Leading Fund, Hui Hua Fund, Yufu Capital and ICBC Capital Management back electronics companies at Honglin Lianjie's stage. Their profiles are linked below.

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