HChiplet
Latest round
- Series A
Last raised
- Jun 2026
Total raised
- Undisclosed
Investors
- 4
About HChiplet
Founded in 2023, HChiplet Semiconductor operates from Shaoxing, China, and concentrates on chiplet technology and advanced packaging.HChiplet Semiconductor specializes in advanced packaging solutions, primarily focusing on chiplet technology. The company offers a comprehensive range of services that include integrated circuit packaging design, simulation, and processing testing. Their core offerings encompass the design and development of IC substrates, chip-on-board (COB), and chip-on-film (COF) solutions, aimed at enhancing data integrity and process maturity in semiconductor packaging. These products are utilized in a variety of high-tech applications such as telecommunications, automotive electronics, and advanced computing systems, targeting clients in sectors like smart hardware and storage devices.HChiplet Semiconductor's revenue structure is based on direct business-to-business transactions with semiconductor manufacturers and hardware companies. The firm engages in contractual partnerships, providing customized packaging services that align with client specifications and project requirements. Clients typically place bulk orders for packaging designs, which may involve upfront payments based on project scope or milestones, facilitating seamless transactions. Their flagship services include tailored chiplet packaging solutions, priced according to complexity, materials used, and development timeframes.5D/3D Chiplet advanced packaging platform, enabling the implementation of TSV and InFO mid-line production lines, the expansion of back-end production lines, and high-end R&D investment. Additionally, HChiplet aims to innovate materials and processes, deliver mass production of customer projects, and expand globally into new markets.
Who invested in HChiplet
4 investors across 1 round
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Funding rounds
Series A
Jun 30, 2026
Amount
Undisclosed
Investors
Questions about HChiplet
Who invested in HChiplet?
HChiplet has 4 investors on record across 1 venture round. Sign up free to see every VC on the cap table and the rounds they joined.
How much funding has HChiplet raised?
HChiplet has raised 1 venture round. Sign up free to see how much each round raised and the total.
When did HChiplet last raise money?
HChiplet's most recent round on record is a Series A, in Jun 2026.
What does HChiplet do?
Founded in 2023, HChiplet Semiconductor operates from Shaoxing, China, and concentrates on chiplet technology and advanced packaging.
Where is HChiplet headquartered?
HChiplet is headquartered in Shaoxing, China.
Which VCs invest in companies like HChiplet?
Among active investors with capital left to deploy, Shanghai State-owned Capital Investment Leading Fund, Hui Hua Fund, Yufu Capital and ICBC Capital Management back packaging companies at HChiplet's stage. Their profiles are linked below.
VCs backing packaging startups at Series A
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