Latest round

Series C

Last raised

Oct 2024

Total raised

$14M

Investors

3

About GOLDLINK

Based in Jiaxing China and founded in 2017, GOLDLINK is a semiconductor chip test probe parts developer, mainly focusing on the research and development, production and sales of semiconductor chip test probe parts. The company has been National High-Tech Enterprise and National Specialized and New Little Giant Enterprise. It also cooperated with SMITHS, NOBI, Cohu and other enterprises. GOLDLINK has special processing technologies such as ultra-fine processing capabilities and precision metal alloy drawing, straightening and cutting technology. It also has four manufacturing technologies which are high-precision CNC automatic lathe compound cutting processing, heat treatment of parts and materials, palladium alloy and other bars, coil material manufacturing and surface treatment. The company's main products include semiconductor test probe parts and other fine metal parts, new metal materials such as palladium alloys, RF connector parts, and cable components. Its processing materials include palladium alloy, carbon steel, PBT and other materials. The products can be used in industries such as semiconductor chips, medical treatment, new energy, and other electromechanical equipment. The company generates revenue by providing semiconductor chip test probe parts. The company will explore the medical field, new materials field and micro-product equipment field.

Who invested in GOLDLINK

3 investors across 1 round

See all investors in GOLDLINK

Sign up free to see every VC on the cap table, the rounds they joined, and how much each round raised.

Funding rounds

  1. Series C

    Oct 12, 2024

    Amount

    $14M

    Investors

    Locked

Questions about GOLDLINK

Who invested in GOLDLINK?

GOLDLINK has 3 investors on record across 1 venture round. Sign up free to see every VC on the cap table and the rounds they joined.

How much funding has GOLDLINK raised?

GOLDLINK has raised 1 venture round. Sign up free to see how much each round raised and the total.

When did GOLDLINK last raise money?

GOLDLINK's most recent round on record is a Series C, in Oct 2024.

What does GOLDLINK do?

Based in Jiaxing China and founded in 2017, GOLDLINK is a semiconductor chip test probe parts developer, mainly focusing on the research and development, production and sales of semiconductor chip test probe parts.

Where is GOLDLINK headquartered?

GOLDLINK is headquartered in Jiaxing, China.

Which VCs invest in companies like GOLDLINK?

Among active investors with capital left to deploy, Hui Hua Fund, Yufu Capital, ICBC Capital Management and Ningbo Tongshang Fund back materials companies at GOLDLINK's stage. Their profiles are linked below.

Raising like GOLDLINK? Find the right VCs.

Capital Atlas matches your startup to active investors by stage, sector and region.

Free to start. Upgrade when you're ready to reach out.