China Wafer Level CSP Co.
Latest round
- Series B
Last raised
- Apr 2007
Total raised
- $19M
Investors
- 4
About China Wafer Level CSP Co.
, Ltd focuses on the advancement of semiconductor packaging technologies.8 million., Ltd is involved in the development and mass manufacturing of advanced semiconductor CMOS image sensor packaging. Their product range includes imaging sensors utilized in biometric identification, environmental light sensing, medical electronics, and automotive sensors.4.8 million, to enhance its product offerings and expand into new geographical markets. The company aims to design and launch new imaging products that cater to the evolving needs of sectors like consumer electronics and healthcare, with specific timelines for releases yet to be determined.
Who invested in China Wafer Level CSP Co.
4 investors across 2 rounds
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Questions about China Wafer Level CSP Co.
Who invested in China Wafer Level CSP Co.?
China Wafer Level CSP Co. has 4 investors on record across 2 venture rounds. Sign up free to see every VC on the cap table and the rounds they joined.
How much funding has China Wafer Level CSP Co. raised?
China Wafer Level CSP Co. has raised 2 venture rounds. Sign up free to see how much each round raised and the total.
When did China Wafer Level CSP Co. last raise money?
China Wafer Level CSP Co.'s most recent round on record is a Series B, in Apr 2007.
What does China Wafer Level CSP Co. do?
, Ltd focuses on the advancement of semiconductor packaging technologies.
Where is China Wafer Level CSP Co. headquartered?
China Wafer Level CSP Co. is headquartered in Suzhou, China.
Which VCs invest in companies like China Wafer Level CSP Co.?
Among active investors with capital left to deploy, Shanghai State-owned Capital Investment Leading Fund, Yufu Capital, ICBC Capital Management and Ningbo Tongshang Fund back semiconductors companies at China Wafer Level CSP Co.'s stage. Their profiles are linked below.
VCs backing semiconductors startups at Series B
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