CHENG DU ET MICROELECTRONICS CO.
Latest round
- Series A
Last raised
- Sep 2023
Total raised
- $14M
Investors
- 4
About CHENG DU ET MICROELECTRONICS CO.
, LTD is an electronic equipment manufacturer that focuses on high-performance SOC chip and smart device development. The company has set up branches offices in Shanghai, Wuhan, and Shenzhen, and cooperated with more than 20 enterprises., LTD's products can be categorized into controllable high-performance SOC chips and intelligent equipment. Products within include High-end 32-bit, 64-bit MCUs, MPUs, ADAS, DSPs SoCs. The products can be used in automotive, industrial applications, smart hardware, IoT, consumer electronics and other areas.
Who invested in CHENG DU ET MICROELECTRONICS CO.
4 investors across 1 round
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Funding rounds
Series A
Sep 13, 2023
Amount
$14M
Investors
Questions about CHENG DU ET MICROELECTRONICS CO.
Who invested in CHENG DU ET MICROELECTRONICS CO.?
CHENG DU ET MICROELECTRONICS CO. has 4 investors on record across 1 venture round. Sign up free to see every VC on the cap table and the rounds they joined.
How much funding has CHENG DU ET MICROELECTRONICS CO. raised?
CHENG DU ET MICROELECTRONICS CO. has raised 1 venture round. Sign up free to see how much each round raised and the total.
When did CHENG DU ET MICROELECTRONICS CO. last raise money?
CHENG DU ET MICROELECTRONICS CO.'s most recent round on record is a Series A, in Sep 2023.
What does CHENG DU ET MICROELECTRONICS CO. do?
, LTD is an electronic equipment manufacturer that focuses on high-performance SOC chip and smart device development.
Where is CHENG DU ET MICROELECTRONICS CO. headquartered?
CHENG DU ET MICROELECTRONICS CO. is headquartered in Chengdu, China.
Which VCs invest in companies like CHENG DU ET MICROELECTRONICS CO.?
Among active investors with capital left to deploy, Shanghai State-owned Capital Investment Leading Fund, Hui Hua Fund, Yufu Capital and ICBC Capital Management back semiconductors companies at CHENG DU ET MICROELECTRONICS CO.'s stage. Their profiles are linked below.
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