# XUNLIN

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/xunlin

- Industry: Materials
- Headquarters: Tianjin, China
- Website: www.xunlin-tech.com
- Total disclosed funding: $44M
- Latest round: Series B (Aug 4, 2026)
- Investors on record: 11

## About

Based in Tianjin, China and founded in 2023, Tianjin Xunlin Technology Co., Ltd., trading as XUNLIN, is a company that provides surface treatment process services for electronic substrates and mainly develops copper cladding and other technologies with its own PVD deposition technology. In July 2024, the firm closed a round of angel funding. The company has production lines in Tianjin and Qingdao. The company's chairman, Hongbin Zhen, previously worked at Electrolux and founded the coating technology company Scienwood. In August 2026, XUNLIN raised nearly CNY 200 million in series B funding from Innoangel Fund, Fibonacci VC, Hymson Laser Technology Group, Xiamen Guangpu Electronics Co., Ltd., Tongxin Licheng Capital, Jolmo Capital, Haitong New Venture Capital, QNSH and other investors.

The company is mainly engaged in the surface metallization of ceramic and glass electronic substrates, specifically including double-sided copper cladding of glass substrates for fine circuits and high-thickness copper low-temperature solid-state soldering cladding technology, etc., which can solve the problems of copper-clad glass substrates in the development of semiconductors to advanced processes as well as in high-definition display modules.

The company generates revenue by providing surface metallization of ceramic and glass electronic substrates.

The company will use the latest funding for investing in glass substrate capacity expansion, packaging production line construction and commissioning, process precision upgrade R&D, and the layout of cutting-edge optical communication applications.

## Funding rounds

- Series B, Aug 4, 2026, $30M — Jolmo Capital, Haitong New Venture Capital, Fibonacci VC, Innoangel Fund, Xiamen Guangpu Electronics Co., Ltd., Tongxin Licheng Capital, QNSH, Hymson Laser Technology Group
- Series A, Feb 5, 2026, $14M — Jolmo Capital, Haitong New Venture Capital, Tianjin Binhai Industry Fund Management
- Angel, Jul 16, 2024 — Weihao Chuangxin Capital, Guoqi Zhailian Investment

## Investors

- Weihao Chuangxin Capital (https://capitalatlas.ai/funds/weihao-chuangxin-capital) — Angel
- Guoqi Zhailian Investment — Angel
- Jolmo Capital (https://capitalatlas.ai/funds/jolmo-capital) — Series A, Series B
- Haitong New Venture Capital (https://capitalatlas.ai/funds/haitong-new-venture-capital) — Series A, Series B
- Tianjin Binhai Industry Fund Management (https://capitalatlas.ai/funds/tianjin-binhai-industry-fund-management) — Series A
- Fibonacci VC (https://capitalatlas.ai/funds/fibonacci-vc) — Series B
- Innoangel Fund (https://capitalatlas.ai/funds/innoangel-fund) — Series B
- Xiamen Guangpu Electronics Co., Ltd. — Series B
- Tongxin Licheng Capital (https://capitalatlas.ai/funds/tongxin-licheng-capital) — Series B
- QNSH — Series B
- Hymson Laser Technology Group — Series B
