# Xiamen Sky Semiconductor Technology Co.

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/xiamen-sky-semiconductor-technology-co

- Industry: Semiconductors
- Headquarters: Xiamen, China
- Website: www.sky-semi.com
- Total disclosed funding: $30M
- Latest round: Series B (Dec 6, 2021)
- Investors on record: 10

## About

Xiamen Sky Semiconductor Technology Co., Ltd. specializes in advanced semiconductor packaging solutions, focusing on innovative technologies that enhance performance across various industries.Founded in 2018 in Xiamen, China, Xiamen Sky Semiconductor Technology Co., Ltd. operates within the semiconductor industry, providing advanced packaging solutions. The company has raised USD 15.00 mn in Series B funding in December 2021 from several investors including CICC Capital and Delian Capital. It has closed two deals since its inception, indicating growth in its operational strategy and market presence.Xiamen Sky Semiconductor Technology Co., Ltd. offers a comprehensive range of advanced packaging and system integration services for the semiconductor industry. Their product lineup includes Wafer Level Packaging (WLP), Fan-Out Wafer Level Packaging (WL-F0), and System-in-Package (SiP) solutions that cater to diverse applications such as radio frequency, power devices, MEMS, biomedical, and artificial intelligence. The company serves over a hundred clients globally, providing full-process solutions from design to mass production, primarily targeting markets in Asia, Europe, and North America.Xiamen Sky Semiconductor Technology Co., Ltd. operates on a B2B transaction model, engaging directly with clients for customizable semiconductor packaging solutions. Revenue is generated through direct sales and long-term contracts, with pricing reflecting the complexity of projects undertaken, emphasizing bespoke service offerings.The recent USD 15.00 mn funding raised in December 2021 will be utilized for the construction of the second phase of Yuntian Semiconductor's mass production line. This expansion aims to increase production capacity and enhance service capabilities. The company is also exploring market entry into new geographical regions to broaden its client base and enhance its competitive position in the global semiconductor packaging market.

## Funding rounds

- Series B, Dec 6, 2021, $15M — GP Capital, China International Capital Corporation, TEDA Venture Capital, Yinxinggu Capital, Delian Capital, Xiamen Venture Capital
- Series A, Oct 17, 2020, $15M — Xi'an Investment Holding, Yinxinggu Capital, SDIC Venture Capital, Jiangsu Xinchao Innovation Investment Group, Ginkgo Valley Capital

## Investors

- Xi'an Investment Holding (https://capitalatlas.ai/funds/xi-an-investment-holding) — Series A
- Yinxinggu Capital (https://capitalatlas.ai/funds/yinxinggu-capital) — Series A, Series B
- SDIC Venture Capital (https://capitalatlas.ai/funds/sdic-venture-capital) — Series A
- Jiangsu Xinchao Innovation Investment Group (https://capitalatlas.ai/funds/jiangsu-xinchao-innovation-investment-group) — Series A
- Ginkgo Valley Capital — Series A
- GP Capital (https://capitalatlas.ai/funds/gp-capital) — Series B
- China International Capital Corporation (https://capitalatlas.ai/funds/china-international-capital-corporation) — Series B
- TEDA Venture Capital (https://capitalatlas.ai/funds/teda-venture-capital) — Series B
- Delian Capital (https://capitalatlas.ai/funds/delian-capital) — Series B
- Xiamen Venture Capital (https://capitalatlas.ai/funds/xiamen-venture-capital) — Series B