# XCIC

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/xcic

- Industry: Materials
- Headquarters: Zibo, China
- Website: http://39.105.48.124/
- Latest round: Series B (Nov 29, 2024)
- Investors on record: 3

## About

Based in Zibo, China, and founded in 2021, XCIC operates as a packaging material manufacturer that mainly provides IC substrates for advanced packaging. It has acquired 39 patents and 5 software copyrights. In September 2025, it closed a round of venture funding from new investor DHLT Investment.

The company mainly provides IC packaging substrate. Products include FC-CSP (Flip Chip- Chip Scale Package) package substrate, FC-BGA (Flip Chip- Ball Grid Array) package substrate, and SIP (System in Package) package substrate. The products can be applied to data centers, artificial intelligence, automotive electronics, and other scenarios.

The company generates revenue by providing IC packaging substrate such as FC-CSP package substrate and SIP package substrate.

The company plans to achieve mass production of FC-CSP and FC-BGA in 2025. In 2026, the second phase of FC-BGA products will be expanded.

## Funding rounds

- Series B, Nov 29, 2024 — Cowin Capital, Addor Capital, Jinbang Capital

## Investors

- Cowin Capital (https://capitalatlas.ai/funds/cowin-capital) — Series B
- Addor Capital (https://capitalatlas.ai/funds/addor-capital) — Series B
- Jinbang Capital — Series B