# TylSemi

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/tylsemi

- Industry: Semiconductors
- Headquarters: San Jose, US
- Website: www.tylsemi.ai
- Total disclosed funding: $43M
- Latest round: Seed (Jul 14, 2026)
- Investors on record: 4

## About

TylSemi, Inc., based in the US, manufactures innovative AI infrastructure solutions, specializing in the development of reusable silicon building blocks for advanced systems integration.Founded in 2026, TylSemi, Inc. is dedicated to providing chiplet-first silicon solutions for the AI sector. The company is headquartered in San Jose, US, and has engaged in one deal as of July 14, 2026, raising USD 43.00 mn in a funding round led by Matter Venture Partners with participation from Egis Technology Inc., Global Hands-On VC, and Viola Group. The company was formed to address the growing demand for modular silicon components in AI applications.TYLsemi is a chiplet-first silicon company specializing in AI infrastructure solutions, focusing primarily on the production of reusable silicon building blocks designed for efficient integration into advanced systems. Their core product offerings include TYL.IO, TYL.Power, and TYL.Forge, which collectively address critical functions in AI infrastructure such as XPUs, switches, connectivity, and system scaling. By utilizing validated chiplets, TYLsemi enables clients to streamline the development process, reducing the complexity typically associated with silicon development and offering a direct path from architecture to deployment. The company serves a diverse client base, including technology firms and AI infrastructure developers across North America, Europe, and Asia-Pacific regions, where a growing demand for AI capabilities necessitates robust and scalable solutions. TYLsemi's products are tailored for integration into real-world applications, thereby providing end-users with reliable and efficient systems that enhance operational capabilities.TYLsemi generates revenue through a structured model that incorporates direct sales of its chiplet-based products and custom silicon solutions to business clients operating within the tech sector. Transactions typically occur through B2B relationships, where companies procure TYLsemi's products for integration into their own systems, ensuring a seamless transition from design to production. The revenue model is supported by long-term partnerships and collaborations with technology firms that require ongoing support and customization of silicon solutions, including potential subscription-based services for product updates and enhancements. TYLsemi’s flagship products, such as TYL.IO and TYL.Power, are integral to the revenue stream, catering to the specific needs of clients who demand high-performance, production-ready chiplets. The pricing structure is aligned with the complexity and functionality of the products, reflecting their mission to deliver value-driven solutions in a competitive market.In July 2026, TylSemi, Inc. raised USD 43.00 mn in venture funding, which will be utilized to support the development of new products tailored for the AI sector. The company plans to expand its market presence in North America, Europe, and Asia-Pacific by 2027, where there is an increasing demand for advanced AI solutions. The funding will enable TYLsemi to enhance its product offerings and streamline operations as it ventures into new geographic markets.

## Funding rounds

- Seed, Jul 14, 2026, $43M — Viola Group, Egis Technology Inc., Global Hands-On VC, Matter Venture Partners

## Investors

- Viola Group (https://capitalatlas.ai/funds/viola-group) — Seed
- Egis Technology Inc. — Seed
- Global Hands-On VC (https://capitalatlas.ai/funds/global-hands-on-vc) — Seed
- Matter Venture Partners (https://capitalatlas.ai/funds/matter-venture-partners) — Seed