# Telink

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/telink

- Industry: Semiconductors
- Headquarters: Shanghai, China
- Website: www.telink-semi.cn
- Latest round: Series B (Jan 1, 2017)
- Investors on record: 3

## About

Founded in 2010 and based in Shanghai, China, Telink is an integrated circuit design company that focuses on the research and development of wireless IoT system-level chips. In December 2020, it raised strategic investment from new investors Beijing Zhelead Management, Qingyu Yihe Venture Capital, TTGG Asset Management, Xiaomi Changjiang Capital, Z-Park Fund, and returning investor Teamsun Energy Investment. In 2023, the company was listed on the Shanghai Sci-Tech Innovation Board. Its stock code is 688591. Wenjun Sheng, co-founder and CEO of the company, has served as VP of RFIC department of Wiscomm Microsystem Inc. and engineering director of Spreadtrum. Telink also has subsidiaries or offices in North America, Europe, and India.


The company's main products include traditional Bluetooth (Bluetooth Classic), Bluetooth Low Energy (Bluetooth LE), Zigbee, 6LoWPAN/Thread, Apple HomeKit, and 2.4GHz proprietary protocol and other low-power wireless chips. Its products are used in industries such as smart retail, consumer electronics, smart lighting, smart home, smart medical care, and warehousing and logistics.

In 2022, the company's operating income was CNY 609.3 million, and the net profit was CNY 49.79 million.

## Funding rounds

- Series B, Jan 1, 2017 — PENG Capital, Stalagnate Capital
- Series B, Sep 17, 2015 — Intel Capital

## Investors

- Intel Capital (https://capitalatlas.ai/funds/intel-capital) — Series B
- PENG Capital (https://capitalatlas.ai/funds/peng-capital) — Series B
- Stalagnate Capital (https://capitalatlas.ai/funds/stalagnate-capital) — Series B