# Suzhou Keyang Semiconductor  Technology Co.

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/suzhou-keyang-semiconductor-technology-co

- Industry: Packaging
- Headquarters: Suzhou, China
- Website: www.keyangsemi.com
- Latest round: Series B (Feb 20, 2017)
- Investors on record: 1

## About

Established in 2013 and based in Suzhou, China, Suzhou Keyang Semiconductor Technology Co., Ltd operates as a semiconductor packaging and testing services provider focusing on the development and application of wafer-level chip scale packaging and testing. The company covers a total area of about 47,000 square meters. The core research team has 65 employees and more than 65% has bachelor's degree. In July 2019, it developed slim-type fingerprint II products. In July 2019, Jiangsu Dagang acquired a 65.58% minority stake in the company for CNY 180 million. It cooperates with Huawei, OPPO, Vivo, etc. 

The company provides package test products, including CIS, fingerprint identification chips, security surveillance vehicles, MEMS, and WLCSP, which can be applied in mobile, security, automotive, etc. It adopts TSV, Bumping, and RDL (rewiring) technologies.

## Funding rounds

- Series B, Feb 20, 2017 — Xiangyuxin Capital

## Investors

- Xiangyuxin Capital (https://capitalatlas.ai/funds/xiangyuxin-capital) — Series B