# SiCT

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/sict

- Industry: Materials
- Headquarters: Suzhou, China
- Website: www.jssict.com
- Latest round: Series B (Jan 23, 2025)
- Investors on record: 5

## About

Established in 2021 and based in Suzhou, China, Suzhou Aicheng Technology Co., Ltd, trading under the name SiCT, began with a focus on advanced ceramic materials for semiconductor packaging. The company has since developed product lines including Aluminum Nitride (AlN) and Silicon Nitride (Si3N4) ceramic substrates, Direct Copper Bonding (DCB), and Active Metal Brazed (AMB) substrates. The company continues to strengthen its position in the domestic semiconductor ecosystem while preparing for international expansion. In August 2025, it closed a round of venture funding. The company specializes in the design and manufacturing of high-performance ceramic substrates and semiconductor packaging solutions. Its main products include AlN and Si3N4 ceramic substrates, DCB and AMB substrates, as well as complementary materials such as active solder and DPC products. These offerings support third-generation semiconductor devices by enhancing thermal conductivity, reliability, and energy efficiency. The products are widely used in power electronics for renewable energy systems, electric vehicles, telecommunications equipment and industrial electronics. The company generates revenue through B2B sales of its ceramic substrates and packaging products to manufacturers and distributors of semiconductor and electronic components. Its business model emphasizes large-scale orders and negotiated volume-based pricing, catering to power electronics producers and industrial clients. Revenue is primarily derived from direct sales contracts with domestic and international customers in the semiconductor and electronics industries. The company intends to expand into Europe and North America by the end of 2025, aiming to increase its global market share while continuing to support the growing demand for third-generation semiconductor applications.

## Funding rounds

- Series B, Jan 23, 2025 — Legend Capital, Oriza Holdings, SND Ventures Group, Shenzhen Qianhai Baichuan Fund Management, Ruihe Xingye Asset

## Investors

- Legend Capital — Series B
- Oriza Holdings (https://capitalatlas.ai/funds/oriza-holdings) — Series B
- SND Ventures Group (https://capitalatlas.ai/funds/snd-ventures-group) — Series B
- Shenzhen Qianhai Baichuan Fund Management — Series B
- Ruihe Xingye Asset (https://capitalatlas.ai/funds/ruihe-xingye-asset) — Series B