# Shenzhen Xinyuan New Material Co.

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/shenzhen-xinyuan-new-material-co

- Industry: Materials
- Headquarters: Shenzhen, China
- Website: www.xinyuanmat.cn
- Latest round: Series C (May 29, 2025)
- Investors on record: 2

## About

Based in Shenzhen, China and established in 2022, Shenzhen Xinyuan New Material Co., Ltd. operates as a semiconductor packaging materials developer that provides power semiconductor packaging and advanced integrated circuit packaging solutions. The company has more than 20 employees. The founder of the company, Bo Hu, graduated from Harbin Institute of Technology and has a doctoral degree. In July 2024, it closed a series B funding. In May 2025, Shenzhen Xinyuan New Material Co., Ltd. raised Series C funding from new investor Xiaomi Private Equity Fund Management. The company provides power semiconductor packaging and advanced integrated circuit packaging solutions. It established a materials R&D platform based on silver sintering technology. Products include sintered silver materials, semi-sintered conductive adhesives, instantaneous liquid phase diffusion soldering materials, and electromagnetic shielding materials. Sintered silver materials include pastes, preformed films and electrode sheets. Its products can be used in new energy vehicles, RF communication, smart grid, IGBT, photovoltaic and optoelectronics. Shenzhen Xinyuan New Material Co., Ltd. generates revenue by providing semiconductor packaging materials to power semiconductor and integrated circuit manufacturers.

## Funding rounds

- Series C, May 29, 2025 — Xiaomi Private Equity Fund Management
- Angel, Aug 22, 2022 — South China Venture Capital

## Investors

- South China Venture Capital (https://capitalatlas.ai/funds/south-china-venture-capital) — Angel
- Xiaomi Private Equity Fund Management (https://capitalatlas.ai/funds/xiaomi-private-equity-fund-management) — Series C