# Shenzhen Teyan Semiconductor Equipment Co.

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/shenzhen-teyan-semiconductor-equipment-co

- Industry: Semiconductors
- Headquarters: Shenzhen, China
- Website: www.teyansemi.com
- Total disclosed funding: $8.4M
- Latest round: Series B (Dec 31, 2024)
- Investors on record: 2

## About

Established in 2017 and based in Shenzhen, China, Shenzhen Teyan Semiconductor Equipment Co., Ltd. operates as a smart equipment and precision industrial laser solutions provider that focuses on semiconductors industry. In 2021, this company has acquired National High-tech Enterprise Certificate. In December 2024, Shenzhen Teyan Semiconductor Equipment Co., Ltd raised a series B funding led by new investor Goldport Capital.

The company provides smart equipment and precision industrial laser solutions. The company provides also Sputter target application service. The company's product includes semiconductor and non semiconductor. Semiconductor includes wafer, substrate and package, such as laser drilling, laser marking and plasma etching. Non semiconductor includes PCB/FPC and glass. The company's technical includes fanout/in package and SiP. Fanout/in package includes Wafer Laser Debonding, EMC Laser marking and Laser TMV.

The company generates revenue by developing semiconductors equipment that focuses on SiP, Fanout, 3D WLP, etc.

According to the news, the company will use the funds for preparing and developing products and doing market operations.

## Funding rounds

- Series B, Dec 31, 2024, $6.8M — Goldport Capital
- Series A, Apr 28, 2022, $1.5M — Vinno Capital

## Investors

- Vinno Capital (https://capitalatlas.ai/funds/vinno-capital) — Series A
- Goldport Capital (https://capitalatlas.ai/funds/goldport-capital) — Series B