# SEIDA

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/seida

- Industry: Electronics
- Headquarters: Hangzhou, China
- Website: seida.tech
- Total disclosed funding: $44M
- Latest round: Series A (Mar 9, 2026)
- Investors on record: 5

## About

Based in Hangzhou, China and founded in 2021, Huaxincheng (Hangzhou) Technology Co., Ltd., trading as SEIDA, is engaged in providing cutting-edge solutions in the integrated circuit space, specifically in Electronic Design Automation (EDA). In March 2026, SEIDA raised over CNY 300 million in Series A+ funding from Pudong Venture Capital, Shanghai STVC Group and Linchuang Capital.
The company specializes in providing comprehensive solutions within the integrated circuit sector, focusing primarily on Electronic Design Automation (EDA). The company offers advanced EDA software for chip manufacturing and design, along with Intellectual Property (IP) services critical for managing the complexities of chip design and manufacturing processes. These offerings aim to enhance the efficiency of semiconductor design workflows, catering to a diverse client base that includes semiconductor manufacturers, design houses, and technology firms across key markets in Asia-Pacific, Europe, and North America.
The company generates revenue by doing R&D, and providing chip design services and other related products.

## Funding rounds

- Series A, Mar 9, 2026, $44M — Shanghai STVC Group, Linchuang Capital, Pudong Venture Capital
- Series B, Aug 8, 2025 — China Capital Management, Zhongxin Xicheng

## Investors

- China Capital Management (https://capitalatlas.ai/funds/china-capital-management) — Series B
- Zhongxin Xicheng — Series B
- Shanghai STVC Group (https://capitalatlas.ai/funds/shanghai-stvc-group) — Series A
- Linchuang Capital (https://capitalatlas.ai/funds/linchuang-capital) — Series A
- Pudong Venture Capital (https://capitalatlas.ai/funds/pudong-venture-capital) — Series A