# RadRock Technology Co.

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/radrock-technology-co

- Industry: Electronics
- Headquarters: Shenzhen, China
- Website: www.radrocktech.com
- Total disclosed funding: $14M
- Latest round: Series C (Jun 1, 2020)
- Investors on record: 11

## About

RadRock Technology Co. Ltd, based in Shenzhen, China, specializes in developing advanced semiconductor solutions for high-performance computing and AI applications, addressing the evolving demands of various industries.RadRock Technology Co. Ltd focuses on semiconductor solutions for high-performance computing and artificial intelligence. Founded in 2017, the company has executed 7 deals, with the most recent in August 2021. The CEO and founder is Jianxing Ni. The company headquarters is located in Shenzhen, China. In its latest funding round, RadRock secured CNY 100.000 mn in a Series A round led by GF Qianhe, raising a total amount of CNY 100.000 mn from various investors including Shenzhen Capital Group and Sunic Capital.RadRock Technology Co. Ltd specializes in advanced semiconductor solutions that focus on high-performance computing and artificial intelligence applications. The company offers a variety of innovative chip designs tailored for data centers, edge computing, and IoT devices, enhancing processing speed and energy efficiency. Their products are marketed primarily in North America, Europe, and parts of Asia, addressing the needs of enterprise clients and developers of advanced AI applications.Revenue generation for RadRock Technology Co. Ltd stems from direct sales and strategic partnerships with technology firms, primarily through B2B transactions. The company offers its semiconductor products under flexible pricing agreements, including subscription-based models and one-time purchases, aimed at building long-term client relationships and ensuring consistent revenue streams through repeat business.Moving forward, RadRock Technology Co. Ltd aims to launch new semiconductor products designed for emerging needs in AI workloads and is targeting expansion into new markets, including Europe and North America, by 2023. The recent funding raised from the Series A round in August 2021 will be utilized to support these product developments and geographical expansions.

## Funding rounds

- Series C, Jun 1, 2020 — Fortune Capital, Shunwei Capital, Pengde Capital, Shenzhen Capital Real Estate Fund, Sunic Capital, Hua Ventures
- Series B, Apr 1, 2020 — Shunwei Capital, HUAQIN Telecom Technology Co. Ltd., Hua Ventures, Tinno Mobile Technology Corp.
- Series A, May 20, 2019, $14M — Shenzhen Capital Real Estate Fund, GF Qianhe, Sunic Capital, Shenzhen Qianhai Pengde Innovation Investment
- Angel, May 26, 2017 — Zhengxuan Capital

## Investors

- Zhengxuan Capital (https://capitalatlas.ai/funds/zhengxuan-capital) — Angel
- Shenzhen Capital Real Estate Fund (https://capitalatlas.ai/funds/shenzhen-capital-real-estate-fund) — Series A, Series C
- GF Qianhe — Series A
- Sunic Capital (https://capitalatlas.ai/funds/sunic-capital) — Series A, Series C
- Shenzhen Qianhai Pengde Innovation Investment — Series A
- Shunwei Capital (https://capitalatlas.ai/funds/shunwei-capital) — Series B, Series C
- HUAQIN Telecom Technology Co. Ltd. — Series B
- Hua Ventures (https://capitalatlas.ai/funds/hua-ventures) — Series B, Series C
- Tinno Mobile Technology Corp. — Series B
- Fortune Capital — Series C
- Pengde Capital (https://capitalatlas.ai/funds/pengde-capital) — Series C