# Opto-Intel

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/opto-intel

- Industry: Semiconductors
- Headquarters: Chongqing, China
- Website: www.opto-intel.com
- Latest round: Series A (May 23, 2024)
- Investors on record: 3

## About

Established in 2021 and based in Chongqing, China, Opto-Intel is a semiconductor company that focuses on the development of semiconductor packaging equipment. The company is headquartered in Chongqing and has offices in Shenzhen, Xi'an, Beijing, Chengdu, Wuhan and Russia. The core team of this company comes from the Chinese Academy of Sciences, Tsinghua University, Northwestern Polytechnical University, and Xi'an University of Electronic Science and Technology. As of 2024, it has been authorized more than twenty patents and passed the GB/T 29490-2013 Enterprise Intellectual Property Management System Certification. 

In May 2024, Opto-Intel closed series A funding from new investors Zhishou Investment, Ancheng Fund and Western (Chongqing) Science City Beibei Park Development and Construction. In September 2025, Opto-Intel closed series B funding from new investor Jinniu Jiaozi Fund.

The company’s main business is providing semiconductor packaging equipment and technology solutions for production, research, and development. The company’s self-developed products include a series of high-performance, high-quality, and cost-effective packaging equipment such as microwave plasma cleaners, vacuum soldering reflow furnaces, silicon carbide chip packaging equipment, and inert gas glove boxes. Its products are used in the field of semiconductor chip packaging.

The company generates revenue by supplying its semiconductor packaging equipment and technology solutions to manufacturers in the semiconductor, optoelectronics, and advanced manufacturing industries.

The series B financing will be primarily used to establish Zhongke Guangzhi (Chengdu) Technology Co., Ltd. in Jinniu District, Chengdu, and to build a Chengdu R&D center, focusing on the R&D and industrialization of semiconductor packaging equipment, including high-precision fully automatic placement machines.

## Funding rounds

- Series A, May 23, 2024 — Ancheng Fund, Zhishou Investment, Western (Chongqing) Science City Beibei Park Development and Construction

## Investors

- Ancheng Fund (https://capitalatlas.ai/funds/ancheng-fund) — Series A
- Zhishou Investment (https://capitalatlas.ai/funds/zhishou-investment) — Series A
- Western (Chongqing) Science City Beibei Park Development and Construction — Series A