# National Center for Advanced Packaging Co.

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/national-center-for-advanced-packaging-co

- Industry: Electronics
- Headquarters: Wuxi, China
- Website: www.ncap-cn.com
- Total disclosed funding: $31M
- Latest round: Series A (Jan 10, 2022)
- Investors on record: 2

## About

Established in 2012 and based in Wuxi, China, National Center for Advanced Packaging Co., Ltd. is an electronic information company that focuses on the research and development of semiconductor packaging and testing pilot technology. The company has completed 6 rounds of funding as of 2022. As of 2022, the company's R&D team consists of the Chinese Academy of Sciences, with nearly 100 R&D personnel, more than half of whom have doctoral degrees and master's degrees. Besides, the company has R&D platform includes 3200? cleanroom, equipped with facilities, for 300mm wafer size 2.5D/3D IC backend processes and packaging assembly, testing and reliability, as well as design and simulation capabilities. As of 2021, a total of 1,083 patents have been applied for, including 950 invention patents, 46 international invention patents, and a total of 561 valid authorized patents, including 444 invention patents and 12 international authorized patents. In June 2025, National Center for Advanced Packaging Co., Ltd. raised CNY 515 million in a venture funding from new investor ICBC Capital Management. The company self-developed technology includes package design, simulation, mid-end wafer level packaging technology, microsystem integration technology, test& analysis and optoelectronic devices packaging technology. The company's main business is research and development wafer-level high-density packaging process and SiP product application. Besides, the company provides design simulation services, advanced packaging technology services and reliability testing and failure analysis for customer.  The company’s revenue is generated by providing wafer-level high-density packaging process services and SiP product applications.

## Funding rounds

- Series A, Jan 10, 2022, $31M — Shenzhen Capital Real Estate Fund, Zhongtu Tuling Capital

## Investors

- Shenzhen Capital Real Estate Fund (https://capitalatlas.ai/funds/shenzhen-capital-real-estate-fund) — Series A
- Zhongtu Tuling Capital (https://capitalatlas.ai/funds/zhongtu-tuling-capital) — Series A