# Microview Intelligent Packaging Technology (Shenzhen) Co.

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/microview-intelligent-packaging-technology-shenzhen-co

- Industry: Semiconductors
- Headquarters: Shenzhen, China
- Website: www.microviewsz.com
- Total disclosed funding: $28M
- Latest round: Series B (Aug 26, 2025)
- Investors on record: 8

## About

Established in 2019 and based in Shenzhen, China, Microview Intelligent Packaging Technology (Shenzhen) Co., Ltd operates as a chip packaging equipment developer that focuses on high-precision optoelectronics R&D. The team member has more than 20 years of experience in the high-precision chip packaging industry and the research team accounts for 60% of its total employees. The company's products are exported to Europe and America. In October 2022, it promoted a 1.5um high-speed and high-precision automatic solid crystal machine MV-15H. In March 2023, the company was recognized as a national high-tech enterprise. In August 2025, it closed a series B funding. The company uses chip packaging processes, mechanical operation, and control platforms, and machine vision and algorithms technologies. Its products are divided into three series, which include general-purpose high-precision molding machine series, special-purpose high-precision molding machine series, and flip-chip machine series, such as high flexibility and high precision molding machine MV-15D, micro-assembly molding machine MV-MAR, and ultrasonic hot press reversing machine MV-15F-TS. Products can be applied in the fields of military, aerospace, and healthcare.  The company generates revenue primarily through the sale of high-precision die bonding machines and related advanced packaging equipment. Additional revenue is derived from after-sales support, customization and international exports.  Following its series B funding, the company plans to expand R&D in next-generation advanced packaging technologies targeting “transmission, storage, and computing” applications for the AI era. It is also advancing product lines into sub-micron bonding precision and expanding internationally, with a localized delivery and support system in East Asia, Southeast Asia and the US.

## Funding rounds

- Series B, Aug 26, 2025, $14M — Haitong Capital, Share Capital, Leaguer Group, Future Capital Discovery Advisory (Hong Kong) Limited, Qianhai Dream Capital
- Series A, Jan 8, 2024 — Puhua Capital, Qianhai CSSC Equity Investment Fund Management
- Series A, Oct 23, 2023, $14M — Haitong Capital, Share Capital
- Series A, Apr 1, 2022 — CoStone Capital

## Investors

- CoStone Capital (https://capitalatlas.ai/funds/costone-capital) — Series A
- Haitong Capital (https://capitalatlas.ai/funds/haitong-capital) — Series A, Series B
- Share Capital (https://capitalatlas.ai/funds/share-capital) — Series A, Series B
- Puhua Capital (https://capitalatlas.ai/funds/puhua-capital) — Series A
- Qianhai CSSC Equity Investment Fund Management (https://capitalatlas.ai/funds/qianhai-cssc-equity-investment-fund-management) — Series A
- Leaguer Group (https://capitalatlas.ai/funds/leaguer-group) — Series B
- Future Capital Discovery Advisory (Hong Kong) Limited (https://capitalatlas.ai/funds/future-capital-discovery-advisory-hong-kong-limited) — Series B
- Qianhai Dream Capital (https://capitalatlas.ai/funds/qianhai-dream-capital) — Series B