# Lingbo Weibu Semiconductor

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/lingbo-weibu-semiconductor

- Industry: Semiconductors
- Headquarters: Suzhou, China
- Latest round: Series A (Sep 23, 2021)
- Investors on record: 1

## About

Based in Changshu, Jiangsu and founded in 2020, Lingbo Weibu Semiconductor is a R & D and manufacturer of semiconductor IC ball bonding equipment. In September 2021, the company completed series A funding from Sinovation Ventures. The company has R & D centers in Shenzhen and Singapore and a production base in Changshu. The founder and chief executive officer Huanran Li, he is graduated from Hong Kong Polytechnic University, he has worked in ASM, Swire technology and Hong Kong Xinke. The company's core team members has more than 20 years of experience in the semiconductor equipment industry.

The company's product is IC ball bonder, it involves many interdisciplinary subjects such as mechanical structure, motion control, machine vision and so on, it can be used in the equipment and related industries of semiconductor post process packaging.

## Funding rounds

- Series A, Sep 23, 2021 — Sinovation Ventures

## Investors

- Sinovation Ventures (https://capitalatlas.ai/funds/sinovation-ventures) — Series A