# JoinSilicon

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/joinsilicon

- Industry: Semiconductors
- Headquarters: Beijing, China
- Website: www.joinsilicon.com
- Total disclosed funding: $42M
- Latest round: Series C (Jan 23, 2026)
- Investors on record: 14

## About

Established in 2021 and based in Beijing, China, JoinSilicon Microelectronics (Beijing) Co., Ltd., trading as JoinSilicon, is company focusing on advanced process IC (integrated circuit) design, dedicated to IP (intellectual property) services, empowering chip design and SoC (System-on-Chip) customization solutions. 

In January 2026, JoinSilicon closed series C funding co-led by new investors E-town international Industrial Investment Management and Beijing Infrastructure Investment, with participation from new investors Shenzhen Capital Real Estate Fund, Cornerstone Capital, Hongtai Aplus, Linghong Capital and Chengdu Hi-Tech Development Co.,Ltd. and returning investor G&O.

JoinSilicon provides turnkey ASIC (application-specific integrated circuit), IC (integrated circuit) design service, package design, IP integration and customization design, embedded software design and validation and chip customize design services for customers. The chip customization covers RTL design, verification, tape-out, and package testing. Based on the IC technology platform, the company has customized and developed a number of SoCs for customers. Products can be applied in the fields of computing, servers, 5G communications and networks, and automotive electronics, etc.

The series C financing will enable the company to accelerate the mass production of its Chiplet products and the implementation of agile development solutions for the post-Moore's Law era.

## Funding rounds

- Series C, Jan 23, 2026 — Cornerstone Capital, Hongtai Aplus, Shenzhen Capital Real Estate Fund, E-town international Industrial Investment Management, Beijing Infrastructure Investment, Chengdu Hi-Tech Development Co.,Ltd., G&O
- Series B, Jan 2, 2024, $14M — SDIC Venture Capital, Z&Y Capital
- Series A, Sep 8, 2023, $14M — Liantong Innovation Equity Investment Management, Shang Qi Capital
- Series A, Apr 14, 2023, $15M — Shanghai Zhangjiang Science & Technology Venture Capital, Hongtai Aplus, Z&Y Capital
- Angel, Oct 12, 2021 — CoStone Capital, Jolmo Capital

## Investors

- CoStone Capital (https://capitalatlas.ai/funds/costone-capital) — Angel
- Jolmo Capital (https://capitalatlas.ai/funds/jolmo-capital) — Angel
- Shanghai Zhangjiang Science & Technology Venture Capital — Series A
- Hongtai Aplus (https://capitalatlas.ai/funds/hongtai-aplus) — Series A, Series C
- Z&Y Capital (https://capitalatlas.ai/funds/z-y-capital) — Series A, Series B
- Liantong Innovation Equity Investment Management (https://capitalatlas.ai/funds/liantong-innovation-equity-investment-management) — Series A
- Shang Qi Capital (https://capitalatlas.ai/funds/shang-qi-capital) — Series A
- SDIC Venture Capital (https://capitalatlas.ai/funds/sdic-venture-capital) — Series B
- Cornerstone Capital (https://capitalatlas.ai/funds/cornerstone-capital) — Series C
- Shenzhen Capital Real Estate Fund (https://capitalatlas.ai/funds/shenzhen-capital-real-estate-fund) — Series C
- E-town international Industrial Investment Management — Series C
- Beijing Infrastructure Investment — Series C
- Chengdu Hi-Tech Development Co.,Ltd. — Series C
- G&O (https://capitalatlas.ai/funds/g-o) — Series C