# Jinzuan Technology

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/jinzuan-technology

- Industry: Semiconductors
- Headquarters: Suzhou, China
- Latest round: Series A (Mar 29, 2022)
- Investors on record: 1

## About

Established in 2020 and based in Suzhou, China, Jinzuan Technology is a high-tech enterprise that provides chip heat dissipation packaging materials and device products. In October 2024, the company closed a series B funding from Kunshan Hi-Tech Venture Capital.

The company's main products include power device packaging substrates such as aluminum oxide, aluminum nitride and diamond copper. It also provides process services such as grinding and polishing, powder coating, plasma hot pressing and prefabricated gold-tin solder. The company's products and services are used in semiconductor power module applications such as RF and optoelectronics.

The company generates revenue by providing semiconductor packaging heat sink material products and providing related process technology services.

The company will enhance sales scale and accelerate product development and production line construction.

## Funding rounds

- Series A, Mar 29, 2022 — SND Ventures Group

## Investors

- SND Ventures Group (https://capitalatlas.ai/funds/snd-ventures-group) — Series A