# Jiangsu Silicon Integrity Semiconductor Technology Limited Company

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/jiangsu-silicon-integrity-semiconductor-technology-limited-c

- Industry: Semiconductors
- Headquarters: Nanjing, China
- Website: www.jssisemi.com
- Total disclosed funding: $155M
- Latest round: Series A (Oct 15, 2021)
- Investors on record: 13

## About

Established in 2020 and based in Nanjing, China, Jiangsu Silicon Integrity Semiconductor Technology Limited Company operates as a semiconductor packaging and testing service provider that focuses on mobile products. In March 2023, its Advanced Packaging Technology Institute launched the CAPiC platform. The company has applied for 156 patents and has been granted 98 patents, including 8 invention patents and 90 utility model patents. In June 2023, Jssi Semi completed a strategic investment from new investors Longtou Capital and Jiangsu Xinchao Technology Group.In July 2025, Jiangsu Silicon Integrity Semiconductor Technology Limited Company raised approximately CNY 400 million oof venture funding from new investors Yuanhe Puhua Suzhou Management, Shenzhen Qianhai Yunxi Fund Management and other unspecified investors. The company provides semiconductor packaging and testing services and solutions for semiconductor industry users. The business of the company includes chip testing, chip design, wafer bump packaging, and ball grid array packaging. The products include QFN, WLCSP, BGA, LGA, SiP, WLCSP, POP, FANOUT, and 2.5D/3D packages. Jssi Semi also provides turn-key technical solutions, JSSI for bumping, and JSSI product test capability chip probing and final test (CP&FT). Revenue is generated through production and testing service for semiconductor industry users. The financing will be mainly used to further accelerate the layout of SiP (system-level packaging), FOWLP (fan-out wafer-level packaging), Chiplet-2.5D/3D, heterogeneous packaging modules and other high-end packaging and testing technology research and development and production.

## Funding rounds

- Series A, Oct 15, 2021, $155M — GP Capital, CS Capital, SL Capital, Hua Ventures, Firstlight Capital, Xiaomi Ventures, Fengling Capital, Panorama Capital, OPPO
- Series A, Aug 31, 2021 — GP Capital, Zijin Venture Capital, Cherish Capital, Long Capital, Sumin Investment, Firstlight Capital, Xiaomi Ventures, Panorama Capital
- Angel, Jan 11, 2021 — Firstlight Capital

## Investors

- Firstlight Capital — Angel, Series A
- GP Capital (https://capitalatlas.ai/funds/gp-capital) — Series A
- Zijin Venture Capital (https://capitalatlas.ai/funds/zijin-venture-capital) — Series A
- Cherish Capital (https://capitalatlas.ai/funds/cherish-capital) — Series A
- Long Capital (https://capitalatlas.ai/funds/long-capital) — Series A
- Sumin Investment (https://capitalatlas.ai/funds/sumin-investment) — Series A
- Xiaomi Ventures (https://capitalatlas.ai/funds/xiaomi-ventures) — Series A
- Panorama Capital — Series A
- CS Capital — Series A
- SL Capital (https://capitalatlas.ai/funds/sl-capital) — Series A
- Hua Ventures (https://capitalatlas.ai/funds/hua-ventures) — Series A
- Fengling Capital — Series A
- OPPO — Series A