# Jiangsu Jingdu Semiconductor Technology

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/jiangsu-jingdu-semiconductor-technology

- Industry: Electronics
- Headquarters: Zhenjiang, China
- Latest round: Series B (Nov 14, 2024)
- Investors on record: 1

## About

Based in Zhenjiang, China and founded in 2018, Jiangsu Jingdu Semiconductor Technology operates as a wafer manufacturer, providing IC packaging and testing services. The company is a wholly subsidiary of Jiangsu Yidu Technology. The core team members were from TSMC, ChipMOS, StarTech Goldpac, and other semiconductor companies. It launched its product line in April 2019. In November 2024, Jiangsu Jingdu Semiconductor Technology closed a series B funding from new investor Amphora Capital.

The packaging production processes of company, such as wafer bumping and IC packaging, testing production lines, engaged in professional packaging, testing services, construction of gold bumping, COF, and COG, can be used for LCD driver integrated circuits for plant bumping, packaging, testing processing services. The products of testing processing services include DDIC, TDDI, AMOLED and other products. The customers of the company are Chipone Technology Co., Ltd, GalaxyCore, Inc., New Vision Microelectronics, and Nanjing Guanhai Microelectronics Co., Ltd.

The company generates revenue by providing IC packaging and testing services.

## Funding rounds

- Series B, Nov 14, 2024 — Amphora Capital

## Investors

- Amphora Capital (https://capitalatlas.ai/funds/amphora-capital) — Series B