# InvenSense

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/invensense

- Industry: Electronics
- Headquarters: San Jose, US
- Website: www.invensense.com
- Total disclosed funding: $38M
- Latest round: Series C (Apr 28, 2008)
- Investors on record: 9

## About

InvenSense, Inc. develops advanced MEMS sensor solutions that enhance motion detection and interaction in consumer electronics, industrial automation, and automotive systems, providing innovative interfaces that improve user experience and device performance.InvenSense, Inc. specializes in MEMS sensor technology, founded in 2003 in San Jose, US. The company went public in November 2011 with an IPO raising USD 75 mn. In 2016, TDK Corp acquired InvenSense for USD 1300 mn, finalizing the deal in May 2017. The current CEOs are Amir Panush and Omar Abed. The company has conducted 5 deals to date, with the most recent deal occurring on November 15, 2011.TDK InvenSense offers a range of MEMS sensor products, including motion sensors, ultrasonic Time-of-Flight (ToF) sensors, MEMS microphones, and automotive motion sensors. The SmartMotion™ platform features various IMUs, while the SmartSonic™ line provides precise ultrasonic sensor technology. These products are supplied globally to major electronics manufacturers and automotive companies, improving functionality in mobile devices, wearables, and smart home products.In 2016, TDK InvenSense reported revenue of USD 418.40 mn and an EBITDA of USD 24.75 mn, primarily generated through direct sales of MEMS sensor products to OEMs in the electronics and automotive sectors, ensuring reliability and performance via B2B agreements.Looking ahead, InvenSense plans to introduce new sensor products and enhance its current offerings. The company aims to expand its market presence in Europe and Asia by 2024, leveraging the funds from its recent acquisition by TDK Corp. This strategic growth will focus on increasing its share in the automotive and industrial automation sectors, utilizing the latest technological advancements in MEMS.

## Funding rounds

- Series C, Apr 28, 2008, $19M — Sierra Ventures, Partech Partners, Artiman Ventures, NTT DOCOMO, SkyLake Equity Partners, Qualcomm Ventures, VentureTech Alliance, Inventec Appliances Corp, HCM Capital
- Series B, Jan 3, 2007, $11M — Partech Partners, Artiman Ventures, Qualcomm Ventures
- Series A, Jan 1, 2004, $8M — Sierra Ventures, Partech Partners, Artiman Ventures, Qualcomm Ventures

## Investors

- Sierra Ventures (https://capitalatlas.ai/funds/sierra-ventures) — Series A, Series C
- Partech Partners (https://capitalatlas.ai/funds/partech-partners) — Series A, Series B, Series C
- Artiman Ventures (https://capitalatlas.ai/funds/artiman-ventures) — Series A, Series B, Series C
- Qualcomm Ventures (https://capitalatlas.ai/funds/qualcomm-ventures) — Series A, Series B, Series C
- NTT DOCOMO — Series C
- SkyLake Equity Partners — Series C
- VentureTech Alliance (https://capitalatlas.ai/funds/venturetech-alliance) — Series C
- Inventec Appliances Corp — Series C
- HCM Capital (https://capitalatlas.ai/funds/hcm-capital) — Series C