# HChiplet

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/hchiplet

- Industry: Packaging
- Headquarters: Shaoxing, China
- Website: www.hchiplet.com
- Latest round: Series A (Jun 30, 2026)
- Investors on record: 4

## About

HChiplet Semiconductor, based in Shaoxing, China, specializes in advanced packaging solutions, focusing on innovative chiplet technology to enhance semiconductor applications across various high-tech sectors.Founded in 2023, HChiplet Semiconductor operates from Shaoxing, China, and concentrates on chiplet technology and advanced packaging. The company has engaged in one deal, with the most recent funding round occurring on June 30, 2026. The founder's history and prior ventures are not publicly detailed.HChiplet Semiconductor specializes in advanced packaging solutions, primarily focusing on chiplet technology. The company offers a comprehensive range of services that include integrated circuit packaging design, simulation, and processing testing. Their core offerings encompass the design and development of IC substrates, chip-on-board (COB), and chip-on-film (COF) solutions, aimed at enhancing data integrity and process maturity in semiconductor packaging. These products are utilized in a variety of high-tech applications such as telecommunications, automotive electronics, and advanced computing systems, targeting clients in sectors like smart hardware and storage devices. Geographically, the company serves markets including Asia, North America, and Europe, leveraging its innovative packaging solutions to meet the needs of global semiconductor enterprises.HChiplet Semiconductor's revenue structure is based on direct business-to-business transactions with semiconductor manufacturers and hardware companies. The firm engages in contractual partnerships, providing customized packaging services that align with client specifications and project requirements. Clients typically place bulk orders for packaging designs, which may involve upfront payments based on project scope or milestones, facilitating seamless transactions. Their flagship services include tailored chiplet packaging solutions, priced according to complexity, materials used, and development timeframes. These structured agreements enhance the company's ability to meet varying demands from its clientele in the semiconductor ecosystem.In June 2026, HChiplet raised an undisclosed amount of SERIES A1 funding led by Zhangjiang Science & Technology Venture Capital, with participation from Casx Capital, Suzhou Yongxin Fangzhou Investment, Wanlin Investment Management, and other investors. The funding will accelerate the development of a one-stop, end-to-end 2.5D/3D Chiplet advanced packaging platform, enabling the implementation of TSV and InFO mid-line production lines, the expansion of back-end production lines, and high-end R&D investment. Additionally, HChiplet aims to innovate materials and processes, deliver mass production of customer projects, and expand globally into new markets.

## Funding rounds

- Series A, Jun 30, 2026 — Suzhou Yongxin Fangzhou Investment, Wanlin Investment Management, Casx Capital, Zhangjiang Science & Technology Venture Capital

## Investors

- Suzhou Yongxin Fangzhou Investment (https://capitalatlas.ai/funds/suzhou-yongxin-fangzhou-investment) — Series A
- Wanlin Investment Management (https://capitalatlas.ai/funds/wanlin-investment-management) — Series A
- Casx Capital — Series A
- Zhangjiang Science & Technology Venture Capital (https://capitalatlas.ai/funds/zhangjiang-science-technology-venture-capital) — Series A