# Hanchi

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/hanchi

- Industry: Semiconductors
- Headquarters: Shenzhen, China
- Website: www.hanchitech.com
- Latest round: Series B (Apr 24, 2026)
- Investors on record: 6

## About

Founded in 2018 and based in Shenzhen, China, Shenzhen Hanchi Technology Co., Ltd., trading as Hanchi, provides semiconductor packaging and testing automation and digital manufacturing solutions for the semiconductor manufacturing industry. The company focuses on applying artificial intelligence and industrial automation technologies to high-end manufacturing processes, particularly in semiconductor back-end packaging and testing operations. In April 2026, it closed a series B+ funding from Jiangsu Jinqiao Private Equity Fund Management. Hanchi specializes in semiconductor packaging and testing solutions, integrating intelligent packaging systems with Automated Material Handling Systems (AMHS) to optimize manufacturing efficiency. The company applies AI and robotics to high-end manufacturing and testing fields such as chip and OLED pre- and post-processing. Their products empower clients to create smart factories in the semiconductor industry, offering proprietary intelligent equipment and industrial software for a full lifecycle service with minimal labor requirements, enhancing productivity across over 1,000 industry customers, particularly in China and rapidly developing regions. Hanchi's revenue model is based on B2B transactions, focusing on partnerships with semiconductor firms. The company generates income through direct sales of intelligent packaging solutions and AMHS, alongside ongoing service contracts for maintenance and support. Pricing structures are tailored to individual products, including flagship equipment and software, allowing customers to select solutions that best meet their operational needs. The company will use the series B+ funding in April 2026 to support its technology research and development, capacity expansion, and market development, further consolidating its position in the semiconductor packaging and testing services field.

## Funding rounds

- Series B, Apr 24, 2026 — Jiangsu Jinqiao Private Equity Fund Management
- Series B, Nov 14, 2025 — Shanghai Pudong Hi-tech Investment, Hainan Huacui Enterprise Management
- Series A, Jul 17, 2023 — Xingcheng Capital, Shanghai Xunuo Asset Management
- Series A, Oct 23, 2022 — Tdsh Capital

## Investors

- Tdsh Capital (https://capitalatlas.ai/funds/tdsh-capital) — Series A
- Xingcheng Capital (https://capitalatlas.ai/funds/xingcheng-capital) — Series A
- Shanghai Xunuo Asset Management — Series A
- Shanghai Pudong Hi-tech Investment (https://capitalatlas.ai/funds/shanghai-pudong-hi-tech-investment) — Series B
- Hainan Huacui Enterprise Management — Series B
- Jiangsu Jinqiao Private Equity Fund Management (https://capitalatlas.ai/funds/jiangsu-jinqiao-private-equity-fund-management) — Series B