# Guangdong Lingcun Integrated Circuit

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/guangdong-lingcun-integrated-circuit

- Industry: Electronics
- Headquarters: Zhongshan, China
- Total disclosed funding: $28M
- Latest round: Series A (Jun 5, 2023)
- Investors on record: 1

## About

Established in 2023 and based in Zhongshan, China, Guangdong Lingcun Integrated Circuit operates as a fully automated chip inspection and chip packaging services provider. In June 2023, it raised CNY 200 million in series A funding from Toposcend Capital. 

The business of the company includes sales, design and services  of integrated circuit chips and products, manufacturing of semiconductor device specific equipment.

## Funding rounds

- Series A, Jun 5, 2023, $28M — Toposcend Capital

## Investors

- Toposcend Capital (https://capitalatlas.ai/funds/toposcend-capital) — Series A