# Fortsense

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/fortsense

- Industry: Electronics
- Headquarters: Shenzhen, China
- Website: www.fortsense.com
- Latest round: Series C (Dec 8, 2022)
- Investors on record: 10

## About

Based in Shenzhen, China, and established in 2017, Fortsense Technology Co., Ltd., trading as Fortsense, is a chip company dedicated to the R&D and design of intelligent sensors and processor chips and the development of supporting algorithms. The founder and chair of the board, Lianghua Mo, is director of Guangdong Human-Computer Interaction Sensor Engineering Technology Research Center. In October 2018, it released 3D structured light technology. In April 2019, it released LCD under-screen fingerprint solutions. Fortsense won the Shenzhen Integrated Circuit Industry Association 2020 Best Biometric Chip Design Award in 2021. It has partnerships with SMIC, Hua Tian, and CSMC. In December 2025, Fortsense raised over CNY 200 million in Strategic investment from new investors Shenzhen Futian Guiding Fund and Grain Harvest Private Equity Fund Management.


The company's products can be categorized into optical sensing series and machine vision series, including OLED under-screen fingerprint, AMOLED ultra-thin under-screen fingerprint, LCD under-screen fingerprint, under-screen optical sensing 5-in-1 sensor, sensor chip and solution, 3D structured light, and edge computing chips. It also provides a variety of chips and complete technology solutions for consumer electronics, IoT, autonomous mobile devices, and automotive electronics, such as biometrics, machine vision, and edge computing.

The company generates revenue by doing R&D, and providing intelligent sensors and processor chips and other related products.

The strategic investment raised in December 2025 will be primarily used for the research and development of the company's next-generation all-solid-state lidar core chips and the promotion of automotive-grade mass production.

## Funding rounds

- Series C, Dec 8, 2022 — Chengdu Science and Technology Venture Capital Group, Shenzhen Hui Capital Limited, SIIC Fund, Zhuhai Hi-tech Venture Capital, Juffett Capital, BAIC Capital, Suzhou Xiangcheng Fund, Shenzhen Heavy Investment
- Series B, Sep 4, 2019 — New Value Capital, Yinhong Fund

## Investors

- New Value Capital — Series B
- Yinhong Fund (https://capitalatlas.ai/funds/yinhong-fund) — Series B
- Chengdu Science and Technology Venture Capital Group (https://capitalatlas.ai/funds/chengdu-science-and-technology-venture-capital-group) — Series C
- Shenzhen Hui Capital Limited — Series C
- SIIC Fund (https://capitalatlas.ai/funds/siic-fund) — Series C
- Zhuhai Hi-tech Venture Capital (https://capitalatlas.ai/funds/zhuhai-hi-tech-venture-capital) — Series C
- Juffett Capital (https://capitalatlas.ai/funds/juffett-capital) — Series C
- BAIC Capital (https://capitalatlas.ai/funds/baic-capital) — Series C
- Suzhou Xiangcheng Fund (https://capitalatlas.ai/funds/suzhou-xiangcheng-fund) — Series C
- Shenzhen Heavy Investment (https://capitalatlas.ai/funds/shenzhen-heavy-investment) — Series C