# Cencorp

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/cencorp-2

- Industry: Industrial Machinery
- Headquarters: Zhuhai, China
- Website: www.cencorp.com.cn
- Total disclosed funding: $15M
- Latest round: Series B (Nov 20, 2025)
- Investors on record: 10

## About

Founded in 1978 and based in Zhuhai, China, Cencorp (Zhuhai) Industrial Technology Co., Ltd., trading under the name Cencorp, develops industrial automation equipment for electronics and semiconductor manufacturing. The company provides process automation systems, including depaneling, dispensing, odd-form placement and semiconductor handling equipment. It operates production and R&D facilities in Zhuhai, Chengdu and Taicang, with overseas branches in the United States, Germany, Denmark and Finland. In November 2025, Cencorp closed a series B++ funding round from Yunqi Partners and Zhuhai Doumen Financial Investment.

The company works with enterprise clients in electronics, automotive and semiconductor manufacturing to provide depaneling equipment, dispensing systems, odd-form placement machines and semiconductor pick-and-place solutions. It also offers automation solutions such as PD power supply assembly, mobile battery pad printing and high-speed inspection lines.

The company’s revenue is generated by selling industrial automation equipment and providing customized automation solutions to B2B customers across electronics and semiconductor manufacturing. 

The company plans to expand core technology R&D, scale production capacity, and strengthen market development.
The company works with enterprise clients in electronics, automotive and semiconductor manufacturing to provide depaneling equipment, dispensing systems, odd-form placement machines and semiconductor pick-and-place solutions. It also offers automation solutions such as PD power supply assembly, mobile battery pad printing and high-speed inspection lines.

The company’s revenue is generated by selling industrial automation equipment and providing customized automation solutions to B2B customers across electronics and semiconductor manufacturing. 

The company plans to expand core technology R&D, scale production capacity, and strengthen market development.

## Funding rounds

- Series B, Nov 20, 2025 — Yunqi Partners
- Series B, Jul 2, 2025 — Yunqi Partners, Hawkins Capital, Zhuhai Hi-tech Venture Capital, Chengdu Airport Innovation and Entrepreneurship Investment, Zhuhai Science & Technology Venture, Jinfu Capital
- Series C, Jun 20, 2025 — Yunqi Partners, Zhuhai Hi-tech Venture Capital, Chengdu Airport Innovation and Entrepreneurship Investment, Zhuhai Science & Technology Venture
- Series B, Oct 26, 2023, $14M — Winreal Investment, Xiamen C&D Emerging Industry Equity Investment, Seine Ventures
- Series A, Dec 12, 2016, $1.5M — Qiming Venture Partners

## Investors

- Qiming Venture Partners (https://capitalatlas.ai/funds/qiming-venture-partners) — Series A
- Winreal Investment (https://capitalatlas.ai/funds/winreal-investment) — Series B
- Xiamen C&D Emerging Industry Equity Investment (https://capitalatlas.ai/funds/xiamen-c-d-emerging-industry-equity-investment) — Series B
- Seine Ventures (https://capitalatlas.ai/funds/seine-ventures) — Series B
- Yunqi Partners (https://capitalatlas.ai/funds/yunqi-partners) — Series C, Series B
- Zhuhai Hi-tech Venture Capital (https://capitalatlas.ai/funds/zhuhai-hi-tech-venture-capital) — Series C, Series B
- Chengdu Airport Innovation and Entrepreneurship Investment — Series C, Series B
- Zhuhai Science & Technology Venture — Series C, Series B
- Hawkins Capital (https://capitalatlas.ai/funds/hawkins-capital) — Series B
- Jinfu Capital (https://capitalatlas.ai/funds/jinfu-capital) — Series B