# Bump Technologies

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/bump-technologies

- Industry: Software
- Headquarters: Mountain View, US
- Website: www.bu.mp
- Total disclosed funding: $20M
- Latest round: Series B (Dec 29, 2010)
- Investors on record: 5

## About

Bump Technologies builds mobile applications that allow two smartphones to identify with one another and transfer information through 'bumping' together.

## Funding rounds

- Series B, Dec 29, 2010, $17M — Hong Shan, Andreessen Horowitz, SV Angel, Sherpalo Ventures
- Series A, Oct 26, 2009, $3.4M — Hong Shan
- Seed, Jul 8, 2009 — Y Combinator

## Investors

- Y Combinator (https://capitalatlas.ai/funds/y-combinator) — Seed
- Hong Shan — Series A, Series B
- Andreessen Horowitz (https://capitalatlas.ai/funds/andreessen-horowitz) — Series B
- SV Angel (https://capitalatlas.ai/funds/sv-angel) — Series B
- Sherpalo Ventures (https://capitalatlas.ai/funds/sherpalo-ventures) — Series B