# Bonotec Electronic Materials Co.Ltd.

Startup profile on Capital Atlas: https://capitalatlas.ai/startups/bonotec-electronic-materials-co-ltd

- Industry: Materials
- Headquarters: Shanghai, China
- Website: www.bonotec-adhesives.com
- Latest round: Series B (Feb 16, 2022)
- Investors on record: 4

## About

Established in 2009 and based in Shanghai, China, Bonotec Electronic Materials Co.Ltd. operates as a packaging and bonding materials provider that focuses on electronics assembly and semiconductor packaging. The ExBond series of the company have been adopted in die-attach and assembly in 2009. The company added ExSilica (silicone adhesive) and ExSeal (Sealant) in 2011. The company passed ISO9001 quality system certification and obtained the title of national high-tech enterprisein 2011. The core research team of the company has more than 40% members of its total employees.

The company provides adhesive solution for many industries such as integrated circuit, electronics assembly and semiconductor packaging. The company also provides customized services for clients, such as product chemical system determination and thermal properties testing. The company's products include ExSilica (silicone adhesive) and ExSeal (Sealant). The company's solutions include die attach solutions for SOP, die attach solutions for IC and optical communication.

The company will invest in product R&D and expanding capacity in series B funding.

## Funding rounds

- Series B, Feb 16, 2022 — Sumin Investment, Jiangsu Xinchao Innovation Investment Group
- Series B, Apr 27, 2018 — China Fortune-Tech Capital, Step Fund
- Angel, Oct 1, 2010 — Step Fund

## Investors

- Step Fund (https://capitalatlas.ai/funds/step-fund) — Angel, Series B
- China Fortune-Tech Capital (https://capitalatlas.ai/funds/china-fortune-tech-capital) — Series B
- Sumin Investment (https://capitalatlas.ai/funds/sumin-investment) — Series B
- Jiangsu Xinchao Innovation Investment Group (https://capitalatlas.ai/funds/jiangsu-xinchao-innovation-investment-group) — Series B
